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-rw-r--r--Documentation/hwmon/w83791d2
-rw-r--r--Documentation/hwmon/w83792d3
2 files changed, 2 insertions, 3 deletions
diff --git a/Documentation/hwmon/w83791d b/Documentation/hwmon/w83791d
index 90387c3540f7..f4021a285460 100644
--- a/Documentation/hwmon/w83791d
+++ b/Documentation/hwmon/w83791d
@@ -17,7 +17,7 @@ Credits:
17 Philip Edelbrock <phil@netroedge.com>, 17 Philip Edelbrock <phil@netroedge.com>,
18 and Mark Studebaker <mdsxyz123@yahoo.com> 18 and Mark Studebaker <mdsxyz123@yahoo.com>
19 w83792d.c: 19 w83792d.c:
20 Chunhao Huang <DZShen@Winbond.com.tw>, 20 Shane Huang (Winbond),
21 Rudolf Marek <r.marek@assembler.cz> 21 Rudolf Marek <r.marek@assembler.cz>
22 22
23Additional contributors: 23Additional contributors:
diff --git a/Documentation/hwmon/w83792d b/Documentation/hwmon/w83792d
index 8a023ce0b72e..53f7b6866fec 100644
--- a/Documentation/hwmon/w83792d
+++ b/Documentation/hwmon/w83792d
@@ -7,8 +7,7 @@ Supported chips:
7 Addresses scanned: I2C 0x2c - 0x2f 7 Addresses scanned: I2C 0x2c - 0x2f
8 Datasheet: http://www.winbond.com.tw 8 Datasheet: http://www.winbond.com.tw
9 9
10Author: Chunhao Huang 10Author: Shane Huang (Winbond)
11Contact: DZShen <DZShen@Winbond.com.tw>
12 11
13 12
14Module Parameters 13Module Parameters