usb: musb: introduce DA8xx/OMAP-L1x glue layer

Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>

1 files changed, 4 insertions, 1 deletions

diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig
index cfd38edfcf9e..1dd21c2315e4 100644
--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -45,6 +45,9 @@ config USB_MUSB_SOC
 comment "DaVinci 35x and 644x USB support"
         depends on USB_MUSB_HDRC && ARCH_DAVINCI_DMx
 
+comment "DA8xx/OMAP-L1x USB support"
+        depends on USB_MUSB_HDRC && ARCH_DAVINCI_DA8XX
+
 comment "OMAP 243x high speed USB support"
         depends on USB_MUSB_HDRC && ARCH_OMAP2430
 
@@ -144,7 +147,7 @@ config USB_MUSB_HDRC_HCD
 config MUSB_PIO_ONLY
         bool 'Disable DMA (always use PIO)'
         depends on USB_MUSB_HDRC
-        default y if USB_TUSB6010
+        default USB_TUSB6010 || ARCH_DAVINCI_DA8XX
         help
           All data is copied between memory and FIFO by the CPU.
           DMA controllers are ignored.