diff options
| author | Zhang Rui <rui.zhang@intel.com> | 2012-06-26 04:35:57 -0400 |
|---|---|---|
| committer | Zhang Rui <rui.zhang@intel.com> | 2012-09-24 02:44:36 -0400 |
| commit | 9d99842f99d847191ebd0c28469d2c70fcc5bf9e (patch) | |
| tree | 211624d5fbc557c1226b6270a96807acc3b383df /Documentation | |
| parent | 74051ba50583a5880d4536c1d9333e2493ddfd76 (diff) | |
Thermal: set upper and lower limits
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Diffstat (limited to 'Documentation')
| -rw-r--r-- | Documentation/thermal/sysfs-api.txt | 9 |
1 files changed, 8 insertions, 1 deletions
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index c087dbcf3535..ca1a1a34970e 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt | |||
| @@ -84,7 +84,8 @@ temperature) and throttle appropriate devices. | |||
| 84 | 84 | ||
| 85 | 1.3 interface for binding a thermal zone device with a thermal cooling device | 85 | 1.3 interface for binding a thermal zone device with a thermal cooling device |
| 86 | 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, | 86 | 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, |
| 87 | int trip, struct thermal_cooling_device *cdev); | 87 | int trip, struct thermal_cooling_device *cdev, |
| 88 | unsigned long upper, unsigned long lower); | ||
| 88 | 89 | ||
| 89 | This interface function bind a thermal cooling device to the certain trip | 90 | This interface function bind a thermal cooling device to the certain trip |
| 90 | point of a thermal zone device. | 91 | point of a thermal zone device. |
| @@ -93,6 +94,12 @@ temperature) and throttle appropriate devices. | |||
| 93 | cdev: thermal cooling device | 94 | cdev: thermal cooling device |
| 94 | trip: indicates which trip point the cooling devices is associated with | 95 | trip: indicates which trip point the cooling devices is associated with |
| 95 | in this thermal zone. | 96 | in this thermal zone. |
| 97 | upper:the Maximum cooling state for this trip point. | ||
| 98 | THERMAL_NO_LIMIT means no upper limit, | ||
| 99 | and the cooling device can be in max_state. | ||
| 100 | lower:the Minimum cooling state can be used for this trip point. | ||
| 101 | THERMAL_NO_LIMIT means no lower limit, | ||
| 102 | and the cooling device can be in cooling state 0. | ||
| 96 | 103 | ||
| 97 | 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, | 104 | 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, |
| 98 | int trip, struct thermal_cooling_device *cdev); | 105 | int trip, struct thermal_cooling_device *cdev); |
