usb: dwc3: Add Exynos Specific Glue layer

Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>

1 files changed, 24 insertions, 0 deletions

diff --git a/include/linux/platform_data/dwc3-exynos.h b/include/linux/platform_data/dwc3-exynos.h
new file mode 100644
index 00000000000..5eb7da9b377
--- /dev/null
+++ b/include/linux/platform_data/dwc3-exynos.h
@@ -0,0 +1,24 @@
+/**
+ * dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header.
+ *
+ * Copyright (c) 2012 Samsung Electronics Co., Ltd.
+ *              http://www.samsung.com
+ *
+ * Author: Anton Tikhomirov <av.tikhomirov@samsung.com>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License as published by
+ * the Free Software Foundation; either version 2 of the License, or
+ * (at your option) any later version.
+ */
+
+#ifndef _DWC3_EXYNOS_H_
+#define _DWC3_EXYNOS_H_
+
+struct dwc3_exynos_data {
+        int phy_type;
+        int (*phy_init)(struct platform_device *pdev, int type);
+        int (*phy_exit)(struct platform_device *pdev, int type);
+};
+
+#endif /* _DWC3_EXYNOS_H_ */