diff options
author | Durgadoss R <durgadoss.r@intel.com> | 2012-09-18 01:34:53 -0400 |
---|---|---|
committer | Zhang Rui <rui.zhang@intel.com> | 2012-11-05 00:56:32 -0500 |
commit | 71350db43b4c5c4da59b729c805f00ff6675b99d (patch) | |
tree | b1fdba40aa6849f4392160ea3e0ff581f30fa6c7 /drivers/thermal/thermal_core.h | |
parent | 23064088d6aea049746755e9851760620921a80b (diff) |
Thermal: Move thermal_instance to thermal_core.h
This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Diffstat (limited to 'drivers/thermal/thermal_core.h')
-rw-r--r-- | drivers/thermal/thermal_core.h | 53 |
1 files changed, 53 insertions, 0 deletions
diff --git a/drivers/thermal/thermal_core.h b/drivers/thermal/thermal_core.h new file mode 100644 index 000000000000..0d3205a18112 --- /dev/null +++ b/drivers/thermal/thermal_core.h | |||
@@ -0,0 +1,53 @@ | |||
1 | /* | ||
2 | * thermal_core.h | ||
3 | * | ||
4 | * Copyright (C) 2012 Intel Corp | ||
5 | * Author: Durgadoss R <durgadoss.r@intel.com> | ||
6 | * | ||
7 | * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ | ||
8 | * This program is free software; you can redistribute it and/or modify | ||
9 | * it under the terms of the GNU General Public License as published by | ||
10 | * the Free Software Foundation; version 2 of the License. | ||
11 | * | ||
12 | * This program is distributed in the hope that it will be useful, but | ||
13 | * WITHOUT ANY WARRANTY; without even the implied warranty of | ||
14 | * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU | ||
15 | * General Public License for more details. | ||
16 | * | ||
17 | * You should have received a copy of the GNU General Public License along | ||
18 | * with this program; if not, write to the Free Software Foundation, Inc., | ||
19 | * 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA. | ||
20 | * | ||
21 | * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ | ||
22 | */ | ||
23 | |||
24 | #ifndef __THERMAL_CORE_H__ | ||
25 | #define __THERMAL_CORE_H__ | ||
26 | |||
27 | #include <linux/device.h> | ||
28 | #include <linux/thermal.h> | ||
29 | |||
30 | /* Initial state of a cooling device during binding */ | ||
31 | #define THERMAL_NO_TARGET -1UL | ||
32 | |||
33 | /* | ||
34 | * This structure is used to describe the behavior of | ||
35 | * a certain cooling device on a certain trip point | ||
36 | * in a certain thermal zone | ||
37 | */ | ||
38 | struct thermal_instance { | ||
39 | int id; | ||
40 | char name[THERMAL_NAME_LENGTH]; | ||
41 | struct thermal_zone_device *tz; | ||
42 | struct thermal_cooling_device *cdev; | ||
43 | int trip; | ||
44 | unsigned long upper; /* Highest cooling state for this trip point */ | ||
45 | unsigned long lower; /* Lowest cooling state for this trip point */ | ||
46 | unsigned long target; /* expected cooling state */ | ||
47 | char attr_name[THERMAL_NAME_LENGTH]; | ||
48 | struct device_attribute attr; | ||
49 | struct list_head tz_node; /* node in tz->thermal_instances */ | ||
50 | struct list_head cdev_node; /* node in cdev->thermal_instances */ | ||
51 | }; | ||
52 | |||
53 | #endif /* __THERMAL_CORE_H__ */ | ||