diff options
-rw-r--r-- | Documentation/devicetree/bindings/vendor-prefixes.txt | 1 | ||||
-rw-r--r-- | arch/arm/boot/dts/tegra30-cardhu.dtsi | 10 |
2 files changed, 11 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt index 9de2b9ff9d6e..ac2c2c416a14 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.txt +++ b/Documentation/devicetree/bindings/vendor-prefixes.txt | |||
@@ -51,4 +51,5 @@ ti Texas Instruments | |||
51 | via VIA Technologies, Inc. | 51 | via VIA Technologies, Inc. |
52 | wlf Wolfson Microelectronics | 52 | wlf Wolfson Microelectronics |
53 | wm Wondermedia Technologies, Inc. | 53 | wm Wondermedia Technologies, Inc. |
54 | winbond Winbond Electronics corp. | ||
54 | xlnx Xilinx | 55 | xlnx Xilinx |
diff --git a/arch/arm/boot/dts/tegra30-cardhu.dtsi b/arch/arm/boot/dts/tegra30-cardhu.dtsi index b245e6cf6338..bdb2a660f376 100644 --- a/arch/arm/boot/dts/tegra30-cardhu.dtsi +++ b/arch/arm/boot/dts/tegra30-cardhu.dtsi | |||
@@ -275,6 +275,16 @@ | |||
275 | }; | 275 | }; |
276 | }; | 276 | }; |
277 | 277 | ||
278 | spi@7000da00 { | ||
279 | status = "okay"; | ||
280 | spi-max-frequency = <25000000>; | ||
281 | spi-flash@1 { | ||
282 | compatible = "winbond,w25q32"; | ||
283 | reg = <1>; | ||
284 | spi-max-frequency = <20000000>; | ||
285 | }; | ||
286 | }; | ||
287 | |||
278 | ahub { | 288 | ahub { |
279 | i2s@70080400 { | 289 | i2s@70080400 { |
280 | status = "okay"; | 290 | status = "okay"; |