usb: dwc3: Add Exynos Specific Glue layer

Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>

1 files changed, 13 insertions, 0 deletions

diff --git a/drivers/usb/dwc3/Makefile b/drivers/usb/dwc3/Makefile
index 900ae74357f1..d441fe4c180b 100644
--- a/drivers/usb/dwc3/Makefile
+++ b/drivers/usb/dwc3/Makefile
@@ -28,6 +28,19 @@ endif
 
 obj-$(CONFIG_USB_DWC3)          += dwc3-omap.o
 
+##
+# REVISIT Samsung Exynos platform needs the clk API which isn't
+# defined on all architectures. If we allow dwc3-exynos.c compile
+# always we will fail the linking phase on those architectures
+# which don't provide clk api implementation and that's unnaceptable.
+#
+# When Samsung's platform start supporting pm_runtime, this check
+# for HAVE_CLK should be removed.
+##
+ifneq ($(CONFIG_HAVE_CLK),)
+        obj-$(CONFIG_USB_DWC3)          += dwc3-exynos.o
+endif
+
 ifneq ($(CONFIG_PCI),)
         obj-$(CONFIG_USB_DWC3)          += dwc3-pci.o
 endif