Thermal: Add ST-Ericsson DB8500 thermal driver.

This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

1 files changed, 20 insertions, 0 deletions

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index 99b6587ab8b3..d96da075c9f6 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -101,5 +101,25 @@ config EXYNOS_THERMAL
           If you say yes here you get support for TMU (Thermal Managment
           Unit) on SAMSUNG EXYNOS series of SoC.
 
+config DB8500_THERMAL
+        bool "DB8500 thermal management"
+        depends on ARCH_U8500
+        default y
+        help
+          Adds DB8500 thermal management implementation according to the thermal
+          management framework. A thermal zone with several trip points will be
+          created. Cooling devices can be bound to the trip points to cool this
+          thermal zone if trip points reached.
+
+config DB8500_CPUFREQ_COOLING
+        tristate "DB8500 cpufreq cooling"
+        depends on ARCH_U8500
+        depends on CPU_THERMAL
+        default y
+        help
+          Adds DB8500 cpufreq cooling devices, and these cooling devices can be
+          bound to thermal zone trip points. When a trip point reached, the
+          bound cpufreq cooling device turns active to set CPU frequency low to
+          cool down the CPU.
 
 endif