Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal

Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>

1 files changed, 1 insertions, 1 deletions

diff --git a/drivers/power/power_supply_core.c b/drivers/power/power_supply_core.c
index 08cc8a3c15af..2436f1350013 100644
--- a/drivers/power/power_supply_core.c
+++ b/drivers/power/power_supply_core.c
@@ -201,7 +201,7 @@ static int psy_register_thermal(struct power_supply *psy)
         for (i = 0; i < psy->num_properties; i++) {
                 if (psy->properties[i] == POWER_SUPPLY_PROP_TEMP) {
                         psy->tzd = thermal_zone_device_register(psy->name, 0, 0,
-                                        psy, &psy_tzd_ops, 0, 0, 0, 0);
+                                        psy, &psy_tzd_ops, 0, 0);
                         if (IS_ERR(psy->tzd))
                                 return PTR_ERR(psy->tzd);
                         break;