bonding: fix multiple module load problem

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>

1 files changed, 1 insertions, 0 deletions

diff --git a/drivers/net/bonding/bond_sysfs.c b/drivers/net/bonding/bond_sysfs.c
index 3a1b7b04eb79..5fb861a08664 100644
--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1541,6 +1541,7 @@ int bond_create_sysfs(void)
                         printk(KERN_ERR
                                "network device named %s already exists in sysfs",
                                class_attr_bonding_masters.attr.name);
+                ret = 0;
         }
 
         return ret;