mmc: tmio: split core functionality, DMA and MFD glue

TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to
the one, used in MN5774 and other MN57xx controllers. These IP cores are
included in many multifunction devices, in sh-mobile chips from Renesas,
in the latter case they can also use DMA. Some sh-mobile implementations
also have some other specialities, that MFD-based solutions don't have.
This makes supporting all these features in a monolithic driver inconveniet
and error-prone. This patch splits the driver into 3 parts: the core,
the MFD glue and the DMA support. In case of a modular build, two modules
will be built: mmc_tmio_core and mmc_tmio.

Signed-off-by: Guennadi Liakhovetski <g.liakhovetski@gmx.de>
Acked-by: Paul Mundt <lethal@linux-sh.org>
Signed-off-by: Chris Ball <cjb@laptop.org>

1 files changed, 3 insertions, 0 deletions

diff --git a/drivers/mmc/host/Makefile b/drivers/mmc/host/Makefile
index 30aa6867745f..79c42dd23c0e 100644
--- a/drivers/mmc/host/Makefile
+++ b/drivers/mmc/host/Makefile
@@ -29,6 +29,9 @@ endif
 obj-$(CONFIG_MMC_S3C)           += s3cmci.o
 obj-$(CONFIG_MMC_SDRICOH_CS)    += sdricoh_cs.o
 obj-$(CONFIG_MMC_TMIO)          += tmio_mmc.o
+obj-$(CONFIG_MMC_TMIO_CORE)     += tmio_mmc_core.o
+tmio_mmc_core-y                 := tmio_mmc_pio.o
+tmio_mmc_core-$(CONFIG_TMIO_MMC_DMA)    += tmio_mmc_dma.o
 obj-$(CONFIG_MMC_CB710) += cb710-mmc.o
 obj-$(CONFIG_MMC_VIA_SDMMC)     += via-sdmmc.o
 obj-$(CONFIG_SDH_BFIN)          += bfin_sdh.o