Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal

Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>

1 files changed, 0 insertions, 10 deletions

diff --git a/drivers/hwmon/Kconfig b/drivers/hwmon/Kconfig
index c74e73b2069a..c4633de64465 100644
--- a/drivers/hwmon/Kconfig
+++ b/drivers/hwmon/Kconfig
@@ -334,16 +334,6 @@ config SENSORS_DA9052_ADC
           This driver can also be built as module. If so, the module
           will be called da9052-hwmon.
 
-config SENSORS_EXYNOS4_TMU
-        tristate "Temperature sensor on Samsung EXYNOS4"
-        depends on ARCH_EXYNOS4
-        help
-          If you say yes here you get support for TMU (Thermal Management
-          Unit) on SAMSUNG EXYNOS4 series of SoC.
-
-          This driver can also be built as a module. If so, the module
-          will be called exynos4-tmu.
-
 config SENSORS_I5K_AMB
         tristate "FB-DIMM AMB temperature sensor on Intel 5000 series chipsets"
         depends on PCI