ARM: dts: omap3: Add support for IGEP COM Module

ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>

1 files changed, 1 insertions, 0 deletions

diff --git a/arch/arm/boot/dts/Makefile b/arch/arm/boot/dts/Makefile
index a098c94c8742..de29da573f95 100644
--- a/arch/arm/boot/dts/Makefile
+++ b/arch/arm/boot/dts/Makefile
@@ -120,6 +120,7 @@ dtb-$(CONFIG_ARCH_OMAP2PLUS) += omap2420-h4.dtb \
         omap3-evm.dtb \
         omap3-tobi.dtb \
         omap3-igep0020.dtb \
+        omap3-igep0030.dtb \
         omap4-panda.dtb \
         omap4-panda-a4.dtb \
         omap4-panda-es.dtb \