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authorLen Brown <len.brown@intel.com>2008-02-07 16:55:08 -0500
committerLen Brown <len.brown@intel.com>2008-02-07 23:48:04 -0500
commit543a956140e1f57331c0e528d2367106057aeca0 (patch)
tree41cbe361027a982dc80c1e952a28152af6d89ce6 /Documentation/thermal
parent9f2eef25e044603527e121066284d22f51d853cc (diff)
ACPI: thermal: syntax, spelling, kernel-doc
Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'Documentation/thermal')
-rw-r--r--Documentation/thermal/sysfs-api.txt23
1 files changed, 11 insertions, 12 deletions
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index 5776e090359d..ba9c2da5a8c2 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -14,7 +14,7 @@ The generic thermal sysfs provides a set of interfaces for thermal zone devices
14and thermal cooling devices (fan, processor...) to register with the thermal management 14and thermal cooling devices (fan, processor...) to register with the thermal management
15solution and to be a part of it. 15solution and to be a part of it.
16 16
17This how-to focusses on enabling new thermal zone and cooling devices to participate 17This how-to focuses on enabling new thermal zone and cooling devices to participate
18in thermal management. 18in thermal management.
19This solution is platform independent and any type of thermal zone devices and 19This solution is platform independent and any type of thermal zone devices and
20cooling devices should be able to make use of the infrastructure. 20cooling devices should be able to make use of the infrastructure.
@@ -41,9 +41,9 @@ and throttle appropriate devices.
41 name: the thermal zone name. 41 name: the thermal zone name.
42 trips: the total number of trip points this thermal zone supports. 42 trips: the total number of trip points this thermal zone supports.
43 devdata: device private data 43 devdata: device private data
44 ops: thermal zone device callbacks. 44 ops: thermal zone device call-backs.
45 .bind: bind the thermal zone device with a thermal cooling device. 45 .bind: bind the thermal zone device with a thermal cooling device.
46 .unbind: unbing the thermal zone device with a thermal cooling device. 46 .unbind: unbind the thermal zone device with a thermal cooling device.
47 .get_temp: get the current temperature of the thermal zone. 47 .get_temp: get the current temperature of the thermal zone.
48 .get_mode: get the current mode (user/kernel) of the thermal zone. 48 .get_mode: get the current mode (user/kernel) of the thermal zone.
49 "kernel" means thermal management is done in kernel. 49 "kernel" means thermal management is done in kernel.
@@ -69,7 +69,7 @@ and throttle appropriate devices.
69 It tries to bind itself to all the thermal zone devices register at the same time. 69 It tries to bind itself to all the thermal zone devices register at the same time.
70 name: the cooling device name. 70 name: the cooling device name.
71 devdata: device private data. 71 devdata: device private data.
72 ops: thermal cooling devices callbacks. 72 ops: thermal cooling devices call-backs.
73 .get_max_state: get the Maximum throttle state of the cooling device. 73 .get_max_state: get the Maximum throttle state of the cooling device.
74 .get_cur_state: get the Current throttle state of the cooling device. 74 .get_cur_state: get the Current throttle state of the cooling device.
75 .set_cur_state: set the Current throttle state of the cooling device. 75 .set_cur_state: set the Current throttle state of the cooling device.
@@ -109,7 +109,6 @@ RO read only value
109RW read/write value 109RW read/write value
110 110
111All thermal sysfs attributes will be represented under /sys/class/thermal 111All thermal sysfs attributes will be represented under /sys/class/thermal
112/sys/class/thermal/
113 112
114Thermal zone device sys I/F, created once it's registered: 113Thermal zone device sys I/F, created once it's registered:
115|thermal_zone[0-*]: 114|thermal_zone[0-*]:
@@ -129,7 +128,7 @@ Thermal cooling device sys I/F, created once it's registered:
129These two dynamic attributes are created/removed in pairs. 128These two dynamic attributes are created/removed in pairs.
130They represent the relationship between a thermal zone and its associated cooling device. 129They represent the relationship between a thermal zone and its associated cooling device.
131They are created/removed for each 130They are created/removed for each
132thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful exection. 131thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful execution.
133 132
134|thermal_zone[0-*] 133|thermal_zone[0-*]
135 |-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone 134 |-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone
@@ -147,11 +146,11 @@ type Strings which represent the thermal zone type.
147 Optional 146 Optional
148 147
149temp Current temperature as reported by thermal zone (sensor) 148temp Current temperature as reported by thermal zone (sensor)
150 Unit: degree celsius 149 Unit: degree Celsius
151 RO 150 RO
152 Required 151 Required
153 152
154mode One of the predifned values in [kernel, user] 153mode One of the predefined values in [kernel, user]
155 This file gives information about the algorithm 154 This file gives information about the algorithm
156 that is currently managing the thermal zone. 155 that is currently managing the thermal zone.
157 It can be either default kernel based algorithm 156 It can be either default kernel based algorithm
@@ -164,12 +163,12 @@ mode One of the predifned values in [kernel, user]
164 charge of the thermal management. 163 charge of the thermal management.
165 164
166trip_point_[0-*]_temp The temperature above which trip point will be fired 165trip_point_[0-*]_temp The temperature above which trip point will be fired
167 Unit: degree celsius 166 Unit: degree Celsius
168 RO 167 RO
169 Optional 168 Optional
170 169
171trip_point_[0-*]_type Strings which indicate the type of the trip point 170trip_point_[0-*]_type Strings which indicate the type of the trip point
172 Eg. it can be one of critical, hot, passive, 171 E.g. it can be one of critical, hot, passive,
173 active[0-*] for ACPI thermal zone. 172 active[0-*] for ACPI thermal zone.
174 RO 173 RO
175 Optional 174 Optional
@@ -179,7 +178,7 @@ cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F
179 RO 178 RO
180 Optional 179 Optional
181 180
182cdev[0-*]_trip_point The trip point with which cdev[0-*] is assocated in this thermal zone 181cdev[0-*]_trip_point The trip point with which cdev[0-*] is associated in this thermal zone
183 -1 means the cooling device is not associated with any trip point. 182 -1 means the cooling device is not associated with any trip point.
184 RO 183 RO
185 Optional 184 Optional
@@ -211,7 +210,7 @@ cur_state The current cooling state of this cooling device.
211 210
212ACPI thermal zone may support multiple trip points like critical/hot/passive/active. 211ACPI thermal zone may support multiple trip points like critical/hot/passive/active.
213If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time, 212If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time,
214it may register itself as a thermale_zone_device (thermal_zone1) with 4 trip points in all. 213it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all.
215It has one processor and one fan, which are both registered as thermal_cooling_device. 214It has one processor and one fan, which are both registered as thermal_cooling_device.
216If the processor is listed in _PSL method, and the fan is listed in _AL0 method, 215If the processor is listed in _PSL method, and the fan is listed in _AL0 method,
217the sys I/F structure will be built like this: 216the sys I/F structure will be built like this: