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authorStefan Roese <sr@denx.de>2009-04-16 08:10:45 -0400
committerDavid Woodhouse <David.Woodhouse@intel.com>2009-06-06 03:27:42 -0400
commit143070e74630b9557e1bb64d899ff2cc5a1dcb48 (patch)
tree90f22516649e24837cf435b7ca9f86da0374d257 /Documentation/filesystems/tmpfs.txt
parent43950a605dc76677f0c74dcd818a57d4df040e12 (diff)
mtd: physmap_of: Add multiple regions and concatenation support
This patch adds support to handle multiple non-identical chips in one flash device tree node. It also adds concat support to physmap_of. This makes it possible to support e.g. the Intel P30 48F4400 chips which internally consists of 2 non-identical NOR chips on one die. Additionally partitions now can span over multiple chips. To describe such a chip's, multiple "reg" tuples are now supported in one flash device tree node. Here an dts example: flash@f0000000,0 { #address-cells = <1>; #size-cells = <1>; compatible = "cfi-flash"; reg = <0 0x00000000 0x02000000 0 0x02000000 0x02000000>; bank-width = <2>; partition@0 { label = "test-part1"; reg = <0 0x04000000>; }; }; Signed-off-by: Stefan Roese <sr@denx.de> Reviewed-by: Grant Likely <grant.likely@secretlab.ca> Signed-off-by: David Woodhouse <David.Woodhouse@intel.com>
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