/*
* Generic EDAC defs
*
* Author: Dave Jiang <djiang@mvista.com>
*
* 2006-2008 (c) MontaVista Software, Inc. This file is licensed under
* the terms of the GNU General Public License version 2. This program
* is licensed "as is" without any warranty of any kind, whether express
* or implied.
*
*/
#ifndef _LINUX_EDAC_H_
#define _LINUX_EDAC_H_
#include <linux/atomic.h>
#include <linux/kobject.h>
#include <linux/completion.h>
#include <linux/workqueue.h>
struct device;
#define EDAC_OPSTATE_INVAL -1
#define EDAC_OPSTATE_POLL 0
#define EDAC_OPSTATE_NMI 1
#define EDAC_OPSTATE_INT 2
extern int edac_op_state;
extern int edac_err_assert;
extern atomic_t edac_handlers;
extern struct bus_type edac_subsys;
extern int edac_handler_set(void);
extern void edac_atomic_assert_error(void);
extern struct bus_type *edac_get_sysfs_subsys(void);
extern void edac_put_sysfs_subsys(void);
static inline void opstate_init(void)
{
switch (edac_op_state) {
case EDAC_OPSTATE_POLL:
case EDAC_OPSTATE_NMI:
break;
default:
edac_op_state = EDAC_OPSTATE_POLL;
}
return;
}
#define EDAC_MC_LABEL_LEN 31
#define MC_PROC_NAME_MAX_LEN 7
/* memory devices */
enum dev_type {
DEV_UNKNOWN = 0,
DEV_X1,
DEV_X2,
DEV_X4,
DEV_X8,
DEV_X16,
DEV_X32, /* Do these parts exist? */
DEV_X64 /* Do these parts exist? */
};
#define DEV_FLAG_UNKNOWN BIT(DEV_UNKNOWN)
#define DEV_FLAG_X1 BIT(DEV_X1)
#define DEV_FLAG_X2 BIT(DEV_X2)
#define DEV_FLAG_X4 BIT(DEV_X4)
#define DEV_FLAG_X8 BIT(DEV_X8)
#define DEV_FLAG_X16 BIT(DEV_X16)
#define DEV_FLAG_X32 BIT(DEV_X32)
#define DEV_FLAG_X64 BIT(DEV_X64)
/**
* enum hw_event_mc_err_type - type of the detected error
*
* @HW_EVENT_ERR_CORRECTED: Corrected Error - Indicates that an ECC
* corrected error was detected
* @HW_EVENT_ERR_UNCORRECTED: Uncorrected Error - Indicates an error that
* can't be corrected by ECC, but it is not
* fatal (maybe it is on an unused memory area,
* or the memory controller could recover from
* it for example, by re-trying the operation).
* @HW_EVENT_ERR_FATAL: Fatal Error - Uncorrected error that could not
* be recovered.
*/
enum hw_event_mc_err_type {
HW_EVENT_ERR_CORRECTED,
HW_EVENT_ERR_UNCORRECTED,
HW_EVENT_ERR_FATAL,
};
/**
* enum mem_type - memory types. For a more detailed reference, please see
* http://en.wikipedia.org/wiki/DRAM
*
* @MEM_EMPTY Empty csrow
* @MEM_RESERVED: Reserved csrow type
* @MEM_UNKNOWN: Unknown csrow type
* @MEM_FPM: FPM - Fast Page Mode, used on systems up to 1995.
* @MEM_EDO: EDO - Extended data out, used on systems up to 1998.
* @MEM_BEDO: BEDO - Burst Extended data out, an EDO variant.
* @MEM_SDR: SDR - Single data rate SDRAM
* http://en.wikipedia.org/wiki/Synchronous_dynamic_random-access_memory
* They use 3 pins for chip select: Pins 0 and 2 are
* for rank 0; pins 1 and 3 are for rank 1, if the memory
* is dual-rank.
* @MEM_RDR: Registered SDR SDRAM
* @MEM_DDR: Double data rate SDRAM
* http://en.wikipedia.org/wiki/DDR_SDRAM
* @MEM_RDDR: Registered Double data rate SDRAM
* This is a variant of the DDR memories.
* A registered memory has a buffer inside it, hiding
* part of the memory details to the memory controller.
* @MEM_RMBS: Rambus DRAM, used on a few Pentium III/IV controllers.
* @MEM_DDR2: DDR2 RAM, as described at JEDEC JESD79-2F.
* Those memories are labed as "PC2-" instead of "PC" to
* differenciate from DDR.
* @MEM_FB_DDR2: Fully-Buffered DDR2, as described at JEDEC Std No. 205
* and JESD206.
* Those memories are accessed per DIMM slot, and not by
* a chip select signal.
* @MEM_RDDR2: Registered DDR2 RAM
* This is a variant of the DDR2 memories.
* @MEM_XDR: Rambus XDR
* It is an evolution of the original RAMBUS memories,
* created to compete with DDR2. Weren't used on any
* x86 arch, but cell_edac PPC memory controller uses it.
* @MEM_DDR3: DDR3 RAM
* @MEM_RDDR3: Registered DDR3 RAM
* This is a variant of the DDR3 memories.
*/
enum mem_type {
MEM_EMPTY = 0,
MEM_RESERVED,
MEM_UNKNOWN,
MEM_FPM,
MEM_EDO,
MEM_BEDO,
MEM_SDR,
MEM_RDR,
MEM_DDR,
MEM_RDDR,
MEM_RMBS,
MEM_DDR2,
MEM_FB_DDR2,
MEM_RDDR2,
MEM_XDR,
MEM_DDR3,
MEM_RDDR3,
};
#define MEM_FLAG_EMPTY BIT(MEM_EMPTY)
#define MEM_FLAG_RESERVED BIT(MEM_RESERVED)
#define MEM_FLAG_UNKNOWN BIT(MEM_UNKNOWN)
#define MEM_FLAG_FPM BIT(MEM_FPM)
#define MEM_FLAG_EDO BIT(MEM_EDO)
#define MEM_FLAG_BEDO BIT(MEM_BEDO)
#define MEM_FLAG_SDR BIT(MEM_SDR)
#define MEM_FLAG_RDR BIT(MEM_RDR)
#define MEM_FLAG_DDR BIT(MEM_DDR)
#define MEM_FLAG_RDDR BIT(MEM_RDDR)
#define MEM_FLAG_RMBS BIT(MEM_RMBS)
#define MEM_FLAG_DDR2 BIT(MEM_DDR2)
#define MEM_FLAG_FB_DDR2 BIT(MEM_FB_DDR2)
#define MEM_FLAG_RDDR2 BIT(MEM_RDDR2)
#define MEM_FLAG_XDR BIT(MEM_XDR)
#define MEM_FLAG_DDR3 BIT(MEM_DDR3)
#define MEM_FLAG_RDDR3 BIT(MEM_RDDR3)
/* chipset Error Detection and Correction capabilities and mode */
enum edac_type {
EDAC_UNKNOWN = 0, /* Unknown if ECC is available */
EDAC_NONE, /* Doesn't support ECC */
EDAC_RESERVED, /* Reserved ECC type */
EDAC_PARITY, /* Detects parity errors */
EDAC_EC, /* Error Checking - no correction */
EDAC_SECDED, /* Single bit error correction, Double detection */
EDAC_S2ECD2ED, /* Chipkill x2 devices - do these exist? */
EDAC_S4ECD4ED, /* Chipkill x4 devices */
EDAC_S8ECD8ED, /* Chipkill x8 devices */
EDAC_S16ECD16ED, /* Chipkill x16 devices */
};
#define EDAC_FLAG_UNKNOWN BIT(EDAC_UNKNOWN)
#define EDAC_FLAG_NONE BIT(EDAC_NONE)
#define EDAC_FLAG_PARITY BIT(EDAC_PARITY)
#define EDAC_FLAG_EC BIT(EDAC_EC)
#define EDAC_FLAG_SECDED BIT(EDAC_SECDED)
#define EDAC_FLAG_S2ECD2ED BIT(EDAC_S2ECD2ED)
#define EDAC_FLAG_S4ECD4ED BIT(EDAC_S4ECD4ED)
#define EDAC_FLAG_S8ECD8ED BIT(EDAC_S8ECD8ED)
#define EDAC_FLAG_S16ECD16ED BIT(EDAC_S16ECD16ED)
/* scrubbing capabilities */
enum scrub_type {
SCRUB_UNKNOWN = 0, /* Unknown if scrubber is available */
SCRUB_NONE, /* No scrubber */
SCRUB_SW_PROG, /* SW progressive (sequential) scrubbing */
SCRUB_SW_SRC, /* Software scrub only errors */
SCRUB_SW_PROG_SRC, /* Progressive software scrub from an error */
SCRUB_SW_TUNABLE, /* Software scrub frequency is tunable */
SCRUB_HW_PROG, /* HW progressive (sequential) scrubbing */
SCRUB_HW_SRC, /* Hardware scrub only errors */
SCRUB_HW_PROG_SRC, /* Progressive hardware scrub from an error */
SCRUB_HW_TUNABLE /* Hardware scrub frequency is tunable */
};
#define SCRUB_FLAG_SW_PROG BIT(SCRUB_SW_PROG)
#define SCRUB_FLAG_SW_SRC BIT(SCRUB_SW_SRC)
#define SCRUB_FLAG_SW_PROG_SRC BIT(SCRUB_SW_PROG_SRC)
#define SCRUB_FLAG_SW_TUN BIT(SCRUB_SW_SCRUB_TUNABLE)
#define SCRUB_FLAG_HW_PROG BIT(SCRUB_HW_PROG)
#define SCRUB_FLAG_HW_SRC BIT(SCRUB_HW_SRC)
#define SCRUB_FLAG_HW_PROG_SRC BIT(SCRUB_HW_PROG_SRC)
#define SCRUB_FLAG_HW_TUN BIT(SCRUB_HW_TUNABLE)
/* FIXME - should have notify capabilities: NMI, LOG, PROC, etc */
/* EDAC internal operation states */
#define OP_ALLOC 0x100
#define OP_RUNNING_POLL 0x201
#define OP_RUNNING_INTERRUPT 0x202
#define OP_RUNNING_POLL_INTR 0x203
#define OP_OFFLINE 0x300
/*
* Concepts used at the EDAC subsystem
*
* There are several things to be aware of that aren't at all obvious:
*
* SOCKETS, SOCKET SETS, BANKS, ROWS, CHIP-SELECT ROWS, CHANNELS, etc..
*
* These are some of the many terms that are thrown about that don't always
* mean what people think they mean (Inconceivable!). In the interest of
* creating a common ground for discussion, terms and their definitions
* will be established.
*
* Memory devices: The individual DRAM chips on a memory stick. These
* devices commonly output 4 and 8 bits each (x4, x8).
* Grouping several of these in parallel provides the
* number of bits that the memory controller expects:
* typically 72 bits, in order to provide 64 bits +
* 8 bits of ECC data.
*
* Memory Stick: A printed circuit board that aggregates multiple
* memory devices in parallel. In general, this is the
* Field Replaceable Unit (FRU) which gets replaced, in
* the case of excessive errors. Most often it is also
* called DIMM (Dual Inline Memory Module).
*
* Memory Socket: A physical connector on the motherboard that accepts
* a single memory stick. Also called as "slot" on several
* datasheets.
*
* Channel: A memory controller channel, responsible to communicate
* with a group of DIMMs. Each channel has its own
* independent control (command) and data bus, and can
* be used independently or grouped with other channels.
*
* Branch: It is typically the highest hierarchy on a
* Fully-Buffered DIMM memory controller.
* Typically, it contains two channels.
* Two channels at the same branch can be used in single
* mode or in lockstep mode.
* When lockstep is enabled, the cacheline is doubled,
* but it generally brings some performance penalty.
* Also, it is generally not possible to point to just one
* memory stick when an error occurs, as the error
* correction code is calculated using two DIMMs instead
* of one. Due to that, it is capable of correcting more
* errors than on single mode.
*
* Single-channel: The data accessed by the memory controller is contained
* into one dimm only. E. g. if the data is 64 bits-wide,
* the data flows to the CPU using one 64 bits parallel
* access.
* Typically used with SDR, DDR, DDR2 and DDR3 memories.
* FB-DIMM and RAMBUS use a different concept for channel,
* so this concept doesn't apply there.
*
* Double-channel: The data size accessed by the memory controller is
* interlaced into two dimms, accessed at the same time.
* E. g. if the DIMM is 64 bits-wide (72 bits with ECC),
* the data flows to the CPU using a 128 bits parallel
* access.
*
* Chip-select row: This is the name of the DRAM signal used to select the
* DRAM ranks to be accessed. Common chip-select rows for
* single channel are 64 bits, for dual channel 128 bits.
* It may not be visible by the memory controller, as some
* DIMM types have a memory buffer that can hide direct
* access to it from the Memory Controller.
*
* Single-Ranked stick: A Single-ranked stick has 1 chip-select row of memory.
* Motherboards commonly drive two chip-select pins to
* a memory stick. A single-ranked stick, will occupy
* only one of those rows. The other will be unused.
*
* Double-Ranked stick: A double-ranked stick has two chip-select rows which
* access different sets of memory devices. The two
* rows cannot be accessed concurrently.
*
* Double-sided stick: DEPRECATED TERM, see Double-Ranked stick.
* A double-sided stick has two chip-select rows which
* access different sets of memory devices. The two
* rows cannot be accessed concurrently. "Double-sided"
* is irrespective of the memory devices being mounted
* on both sides of the memory stick.
*
* Socket set: All of the memory sticks that are required for
* a single memory access or all of the memory sticks
* spanned by a chip-select row. A single socket set
* has two chip-select rows and if double-sided sticks
* are used these will occupy those chip-select rows.
*
* Bank: This term is avoided because it is unclear when
* needing to distinguish between chip-select rows and
* socket sets.
*
* Controller pages:
*
* Physical pages:
*
* Virtual pages:
*
*
* STRUCTURE ORGANIZATION AND CHOICES
*
*
*
* PS - I enjoyed writing all that about as much as you enjoyed reading it.
*/
/**
* enum edac_mc_layer - memory controller hierarchy layer
*
* @EDAC_MC_LAYER_BRANCH: memory layer is named "branch"
* @EDAC_MC_LAYER_CHANNEL: memory layer is named "channel"
* @EDAC_MC_LAYER_SLOT: memory layer is named "slot"
* @EDAC_MC_LAYER_CHIP_SELECT: memory layer is named "chip select"
*
* This enum is used by the drivers to tell edac_mc_sysfs what name should
* be used when describing a memory stick location.
*/
enum edac_mc_layer_type {
EDAC_MC_LAYER_BRANCH,
EDAC_MC_LAYER_CHANNEL,
EDAC_MC_LAYER_SLOT,
EDAC_MC_LAYER_CHIP_SELECT,
};
/**
* struct edac_mc_layer - describes the memory controller hierarchy
* @layer: layer type
* @size: number of components per layer. For example,
* if the channel layer has two channels, size = 2
* @is_virt_csrow: This layer is part of the "csrow" when old API
* compatibility mode is enabled. Otherwise, it is
* a channel
*/
struct edac_mc_layer {
enum edac_mc_layer_type type;
unsigned size;
bool is_virt_csrow;
};
/*
* Maximum number of layers used by the memory controller to uniquely
* identify a single memory stick.
* NOTE: Changing this constant requires not only to change the constant
* below, but also to change the existing code at the core, as there are
* some code there that are optimized for 3 layers.
*/
#define EDAC_MAX_LAYERS 3
/**
* EDAC_DIMM_PTR - Macro responsible to find a pointer inside a pointer array
* for the element given by [layer0,layer1,layer2] position
*
* @layers: a struct edac_mc_layer array, describing how many elements
* were allocated for each layer
* @var: name of the var where we want to get the pointer
* (like mci->dimms)
* @n_layers: Number of layers at the @layers array
* @layer0: layer0 position
* @layer1: layer1 position. Unused if n_layers < 2
* @layer2: layer2 position. Unused if n_layers < 3
*
* For 1 layer, this macro returns &var[layer0]
* For 2 layers, this macro is similar to allocate a bi-dimensional array
* and to return "&var[layer0][layer1]"
* For 3 layers, this macro is similar to allocate a tri-dimensional array
* and to return "&var[layer0][layer1][layer2]"
*
* A loop could be used here to make it more generic, but, as we only have
* 3 layers, this is a little faster.
* By design, layers can never be 0 or more than 3. If that ever happens,
* a NULL is returned, causing an OOPS during the memory allocation routine,
* with would point to the developer that he's doing something wrong.
*/
#define EDAC_DIMM_PTR(layers, var, nlayers, layer0, layer1, layer2) ({ \
typeof(var) __p; \
if ((nlayers) == 1) \
__p = &var[layer0]; \
else if ((nlayers) == 2) \
__p = &var[(layer1) + ((layers[1]).size * (layer0))]; \
else if ((nlayers) == 3) \
__p = &var[(layer2) + ((layers[2]).size * ((layer1) + \
((layers[1]).size * (layer0))))]; \
else \
__p = NULL; \
__p; \
})
/* FIXME: add the proper per-location error counts */
struct dimm_info {
char label[EDAC_MC_LABEL_LEN + 1]; /* DIMM label on motherboard */
/* Memory location data */
unsigned location[EDAC_MAX_LAYERS];
struct mem_ctl_info *mci; /* the parent */
u32 grain; /* granularity of reported error in bytes */
enum dev_type dtype; /* memory device type */
enum mem_type mtype; /* memory dimm type */
enum edac_type edac_mode; /* EDAC mode for this dimm */
u32 nr_pages; /* number of pages on this dimm */
unsigned csrow, cschannel; /* Points to the old API data */
};
/**
* struct rank_info - contains the information for one DIMM rank
*
* @chan_idx: channel number where the rank is (typically, 0 or 1)
* @ce_count: number of correctable errors for this rank
* @csrow: A pointer to the chip select row structure (the parent
* structure). The location of the rank is given by
* the (csrow->csrow_idx, chan_idx) vector.
* @dimm: A pointer to the DIMM structure, where the DIMM label
* information is stored.
*
* FIXME: Currently, the EDAC core model will assume one DIMM per rank.
* This is a bad assumption, but it makes this patch easier. Later
* patches in this series will fix this issue.
*/
struct rank_info {
int chan_idx;
struct csrow_info *csrow;
struct dimm_info *dimm;
u32 ce_count; /* Correctable Errors for this csrow */
};
struct csrow_info {
/* Used only by edac_mc_find_csrow_by_page() */
unsigned long first_page; /* first page number in csrow */
unsigned long last_page; /* last page number in csrow */
unsigned long page_mask; /* used for interleaving -
* 0UL for non intlv */
int csrow_idx; /* the chip-select row */
u32 ue_count; /* Uncorrectable Errors for this csrow */
u32 ce_count; /* Correctable Errors for this csrow */
struct mem_ctl_info *mci; /* the parent */
struct kobject kobj; /* sysfs kobject for this csrow */
/* channel information for this csrow */
u32 nr_channels;
struct rank_info *channels;
};
struct mcidev_sysfs_group {
const char *name; /* group name */
const struct mcidev_sysfs_attribute *mcidev_attr; /* group attributes */
};
struct mcidev_sysfs_group_kobj {
struct list_head list; /* list for all instances within a mc */
struct kobject kobj; /* kobj for the group */
const struct mcidev_sysfs_group *grp; /* group description table */
struct mem_ctl_info *mci; /* the parent */
};
/* mcidev_sysfs_attribute structure
* used for driver sysfs attributes and in mem_ctl_info
* sysfs top level entries
*/
struct mcidev_sysfs_attribute {
/* It should use either attr or grp */
struct attribute attr;
const struct mcidev_sysfs_group *grp; /* Points to a group of attributes */
/* Ops for show/store values at the attribute - not used on group */
ssize_t (*show)(struct mem_ctl_info *,char *);
ssize_t (*store)(struct mem_ctl_info *, const char *,size_t);
};
/* MEMORY controller information structure
*/
struct mem_ctl_info {
struct list_head link; /* for global list of mem_ctl_info structs */
struct module *owner; /* Module owner of this control struct */
unsigned long mtype_cap; /* memory types supported by mc */
unsigned long edac_ctl_cap; /* Mem controller EDAC capabilities */
unsigned long edac_cap; /* configuration capabilities - this is
* closely related to edac_ctl_cap. The
* difference is that the controller may be
* capable of s4ecd4ed which would be listed
* in edac_ctl_cap, but if channels aren't
* capable of s4ecd4ed then the edac_cap would
* not have that capability.
*/
unsigned long scrub_cap; /* chipset scrub capabilities */
enum scrub_type scrub_mode; /* current scrub mode */
/* Translates sdram memory scrub rate given in bytes/sec to the
internal representation and configures whatever else needs
to be configured.
*/
int (*set_sdram_scrub_rate) (struct mem_ctl_info * mci, u32 bw);
/* Get the current sdram memory scrub rate from the internal
representation and converts it to the closest matching
bandwidth in bytes/sec.
*/
int (*get_sdram_scrub_rate) (struct mem_ctl_info * mci);
/* pointer to edac checking routine */
void (*edac_check) (struct mem_ctl_info * mci);
/*
* Remaps memory pages: controller pages to physical pages.
* For most MC's, this will be NULL.
*/
/* FIXME - why not send the phys page to begin with? */
unsigned long (*ctl_page_to_phys) (struct mem_ctl_info * mci,
unsigned long page);
int mc_idx;
struct csrow_info *csrows;
unsigned nr_csrows, num_cschannel;
/* Memory Controller hierarchy */
unsigned n_layers;
struct edac_mc_layer *layers;
bool mem_is_per_rank;
/*
* DIMM info. Will eventually remove the entire csrows_info some day
*/
unsigned tot_dimms;
struct dimm_info *dimms;
/*
* FIXME - what about controllers on other busses? - IDs must be
* unique. dev pointer should be sufficiently unique, but
* BUS:SLOT.FUNC numbers may not be unique.
*/
struct device *dev;
const char *mod_name;
const char *mod_ver;
const char *ctl_name;
const char *dev_name;
char proc_name[MC_PROC_NAME_MAX_LEN + 1];
void *pvt_info;
unsigned long start_time; /* mci load start time (in jiffies) */
/*
* drivers shouldn't access those fields directly, as the core
* already handles that.
*/
u32 ce_noinfo_count, ue_noinfo_count;
u32 ue_mc, ce_mc;
u32 *ce_per_layer[EDAC_MAX_LAYERS], *ue_per_layer[EDAC_MAX_LAYERS];
struct completion complete;
/* edac sysfs device control */
struct kobject edac_mci_kobj;
/* list for all grp instances within a mc */
struct list_head grp_kobj_list;
/* Additional top controller level attributes, but specified
* by the low level driver.
*
* Set by the low level driver to provide attributes at the
* controller level.
* An array of structures, NULL terminated
*
* If attributes are desired, then set to array of attributes
* If no attributes are desired, leave NULL
*/
const struct mcidev_sysfs_attribute *mc_driver_sysfs_attributes;
/* work struct for this MC */
struct delayed_work work;
/* the internal state of this controller instance */
int op_state;
};
#endif
