Commit 39d99cff76bf ("thermal: cpu_cooling: introduce
of_cpufreq_cooling_register") taught the cpu cooling device to register
devices that were linked to the device tree but didn't update the
cpu-cooling-api documentation.  Fix it.

Cc: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Jonathan Corbet <corbet@lwn.net>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Changes:
 - Change the maintainer's address (the labri address will expire soon);
 - Drop the note about not all families supporting all fan modes;
 - Add a note about the reported RPM not being accurate when driven outside
   the vbios-defined PWM range.

Signed-off-by: Martin Peres <martin.peres@free.fr>
Signed-off-by: Ben Skeggs <bskeggs@redhat.com>

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.

This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.

In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.

Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch updates the documentation to explain the driver model
and file layout.

Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Pull thermal management updates from Zhang Rui:
 "There are not too many changes this time, except two new platform
  thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal
  driver, and a couple of small fixes.

  Highlights:

   - move the ti-soc-thermal driver out of the staging tree to the
     thermal tree.

   - introduce the x86_pkg_temp_thermal driver.  This driver registers
     CPU digital temperature package level sensor as a thermal zone.

   - small fixes/cleanups including removing redundant use of
     platform_set_drvdata() and of_match_ptr for all platform thermal
     drivers"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
  thermal: cpu_cooling: fix stub function
  thermal: ti-soc-thermal: use standard GPIO DT bindings
  thermal: MAINTAINERS: Add git tree path for SoC specific updates
  thermal: fix x86_pkg_temp_thermal.c build and Kconfig
  Thermal: Documentation for x86 package temperature thermal driver
  Thermal: CPU Package temperature thermal
  thermal: consider emul_temperature while computing trend
  thermal: ti-soc-thermal: add DT example for DRA752 chip
  thermal: ti-soc-thermal: add dra752 chip to device table
  thermal: ti-soc-thermal: add thermal data for DRA752 chips
  thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
  thermal: ti-soc-thermal: freeze FSM while computing trend
  thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
  thermal: ti-soc-thermal: update DT reference for OMAP5430
  x86, mcheck, therm_throt: Process package thresholds
  thermal: cpu_cooling: fix 'descend' check in get_property()
  Thermal: spear: Remove redundant use of of_match_ptr
  Thermal: kirkwood: Remove redundant use of of_match_ptr
  Thermal: dove: Remove redundant use of of_match_ptr
  Thermal: armada: Remove redundant use of of_match_ptr
  ...

Added documentation describing details of the x86 package temperature
thermal driver.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Signed-off-by: Anatol Pomozov <anatol.pomozov@gmail.com>
Signed-off-by: Jiri Kosina <jkosina@suse.cz>

Update kernel Documentation for thermal_zone_device_register.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>