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* hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap2012-09-24
| | | | | | | | | | | | | | | | | | | This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap2012-09-24
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Fix a build error.Eduardo Valentin2012-09-24
| | | | | Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Fix potential NULL pointer accessesGuenter Roeck2012-09-24
| | | | | | | | | | | | The type parameter in thermal_zone_device_register and thermal_cooling_device_register can be NULL, indicating that no sysfs attribute for the type should be created. Only call strlen() and strcpy() on type if it is not NULL. This patch addresses Coverity #102180 and #102182: Dereference before null check Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto2012-09-24
| | | | | | | | | | | | | | This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: fix potential out-of-bounds memory accessGuenter Roeck2012-09-24
| | | | | | | | | | | | | | temp_crit.name and temp_input.name have a length of 16 bytes. Using THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in out-of-bounds memory accesses. Replace it with sizeof(). Addresses Coverity #115679 Signed-off-by: Guenter Roeck <linux@roeck-us.net> Cc: Len Brown <lenb@kernel.org> Cc: "Brown, Len" <len.brown@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Introduce locking for cdev.thermal_instances list.Zhang Rui2012-09-24
| | | | | | | | | | | | | we need to go over all the thermal_instance list of a cooling device to decide which cooling state to put the cooling device to. But at this time, as a cooling device may be referenced in multiple thermal zones, we need to lock the list first in case another thermal zone is updating this cooling device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Unify the code for both active and passive coolingZhang Rui2012-09-24
| | | | | | | | | | Remove thermal_zone_device_passive(). And use thermal_zone_trip_update() and thermal_zone_do_update() for both active and passive cooling. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Introduce simple arbitrator for setting device cooling stateZhang Rui2012-09-24
| | | | | | | | | | | | | | | | | This fixes the problem that a cooling device may be referenced by by multiple trip points in multiple thermal zones. With this patch, we have two stages for updating a thermal zone, 1. check if a thermal_instance needs to be updated or not 2. update the cooling device, based on the target cooling state of all its instances. Note that, currently, the cooling device is set to the deepest cooling state required. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: List thermal_instance in thermal_cooling_device.Zhang Rui2012-09-24
| | | | | | | | | | List thermal_instance in thermal_cooling_device so that cooling device can know the cooling state requirement of all the thermal instances. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Rename thermal_instance.node to thermal_instance.tz_node.Zhang Rui2012-09-24
| | | | | | | | | | | | thermal_instance should be referenced by both thermal zone devices and thermal cooling devices. Rename thermal_instance.node to thermal_instance.tz_node in this patch and thermal_instanace.cdev_node will be introduced in next patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Rename thermal_zone_device.cooling_devicesZhang Rui2012-09-24
| | | | | | | | | | | | Rename thermal_zone_device.cooling_devices to thermal_zone_device.thermal_instances thermal_zone_device.cooling_devices is not accurate as this is a list for thermal instances, rather than cooling devices. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: rename structure thermal_cooling_device_instance to thermal_instanceZhang Rui2012-09-24
| | | | | | | | | | | | This struct is used to describe the behavior for a thermal cooling device on a certain trip point for a certain thremal zone. thermal_cooling_device_instance is not accurate, as a cooling device can be used for more than one trip point in one thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Introduce thermal_zone_trip_update()Zhang Rui2012-09-24
| | | | | | | | | | | | | | | | | | | | | | This function is used to update the cooling state of all the cooling devices that are bound to an active trip point. This will be used for passive cooling as well, in the future patches. as both active and passive cooling can share the same algorithm, which is 1. if the temperature is higher than a trip point, a. if the trend is THERMAL_TREND_RAISING, use higher cooling state for this trip point b. if the trend is THERMAL_TREND_DROPPING, use lower cooling state for this trip point 2. if the temperature is lower than a trip point, use lower cooling state for this trip point. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Remove tc1/tc2 in generic thermal layer.Zhang Rui2012-09-24
| | | | | | | | | Remove tc1/tc2 in generic thermal layer. .get_trend() callback starts to take effect from this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
* Thermal: Introduce .get_trend() callback.Zhang Rui2012-09-24
| | | | | | | | | | | | | | | | | | | | | According to ACPI spec, tc1 and tc2 are used by OSPM to anticipate the temperature trends. We introduced the same concept to the generic thermal layer for passive cooling, but now it seems that these values are hard to be used on other platforms. So We introduce .get_trend() as a more general solution. For the platform thermal drivers that have their own way to anticipate the temperature trends, they should provide their own .get_trend() callback. Or else, we will calculate the temperature trends by simply comparing the current temperature and the cached previous temperature reading. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
* Thermal: set upper and lower limitsZhang Rui2012-09-24
| | | | | | | | | set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Introduce cooling states range supportZhang Rui2012-09-24
| | | | | | | | | | | | | | | | | | | | | As the active cooling devices can have multiple cooling states, we may want only several cooling states for a certain trip point, and other cooling states for other active trip points. To do this, we should be able to describe the cooling device behavior for a certain trip point, rather than for the entire thermal zone. And when updating thermal zone, we need to check the upper and lower limit to make sure the cooling device is set to the proper cooling state. Note that this patch will not bring any different behavior as upper limit is set to max_state and lower limit is set to 0 in this patch, for now. Next patch will set these to real values. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Introduce multiple cooling states supportZhang Rui2012-09-24
| | | | | | | | | This is because general active cooling devices, like fans, may have multiple speeds, which can be mapped to different cooling states. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
* Linux 3.6-rc1Linus Torvalds2012-08-02
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* Merge branch 'for-linus-3.6' of git://dev.laptop.org/users/dilinger/linux-olpcLinus Torvalds2012-08-02
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Pull OLPC platform updates from Andres Salomon: "These move the OLPC Embedded Controller driver out of arch/x86/platform and into drivers/platform/olpc. OLPC machines are now ARM-based (which means lots of x86 and ARM changes), but are typically pretty self-contained.. so it makes more sense to go through a separate OLPC tree after getting the appropriate review/ACKs." * 'for-linus-3.6' of git://dev.laptop.org/users/dilinger/linux-olpc: x86: OLPC: move s/r-related EC cmds to EC driver Platform: OLPC: move global variables into priv struct Platform: OLPC: move debugfs support from x86 EC driver x86: OLPC: switch over to using new EC driver on x86 Platform: OLPC: add a suspended flag to the EC driver Platform: OLPC: turn EC driver into a platform_driver Platform: OLPC: allow EC cmd to be overridden, and create a workqueue to call it drivers: OLPC: update various drivers to include olpc-ec.h Platform: OLPC: add a stub to drivers/platform/ for the OLPC EC driver
| * x86: OLPC: move s/r-related EC cmds to EC driverAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | The new EC driver calls platform-specific suspend and resume hooks; run XO-1-specific EC commands from there, rather than deep in s/r code. If we attempt to run EC commands after the new EC driver has suspended, it is refused by the ec->suspended checks. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * Platform: OLPC: move global variables into priv structAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | Populate olpc_ec_priv with variables that were previously global. This makes things a tad bit clearer, IMO. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * Platform: OLPC: move debugfs support from x86 EC driverAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | | | There's nothing about the debugfs interface for the EC driver that is architecture-specific, so move it into the arch-independent driver. The code is mostly unchanged with the exception of renamed variables, coding style changes, and API updates. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * x86: OLPC: switch over to using new EC driver on x86Andres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | This uses the new EC driver framework in drivers/platform/olpc. The XO-1 and XO-1.5-specific code is still in arch/x86, but the generic stuff (including a new workqueue; no more running EC commands with IRQs disabled!) can be shared with other architectures. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * Platform: OLPC: add a suspended flag to the EC driverAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | | | | | A problem we've noticed on XO-1.75 is when we suspend in the middle of an EC command. Don't allow that. In the process, create a private object for the generic EC driver to use; we have a framework for passing around a struct, use that rather than a proliferation of global variables. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * Platform: OLPC: turn EC driver into a platform_driverAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | | | | | | | The 1.75-based OLPC EC driver already does this; let's do it for all EC drivers. This gives us nice suspend/resume hooks, amongst other things. We want to run the EC's suspend hooks later than other drivers (which may be setting wakeup masks or be running EC commands). We also want to run the EC's resume hooks earlier than other drivers (which may want to run EC commands). Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * Platform: OLPC: allow EC cmd to be overridden, and create a workqueue to call itAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This provides a new API allows different OLPC architectures to override the EC driver. x86 and ARM OLPC machines use completely different EC backends. The olpc_ec_cmd is synchronous, and waits for the workqueue to send the command to the EC. Multiple callers can run olpc_ec_cmd() at once, and they will by serialized and sleep while only one executes on the EC at a time. We don't provide an unregister function, as that doesn't make sense within the context of OLPC machines - there's only ever 1 EC, it's critical to functionality, and it certainly not hotpluggable. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * drivers: OLPC: update various drivers to include olpc-ec.hAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | Switch over to using olpc-ec.h in multiple steps, so as not to break builds. This covers every driver that calls olpc_ec_cmd(). Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
| * Platform: OLPC: add a stub to drivers/platform/ for the OLPC EC driverAndres Salomon2012-07-31
| | | | | | | | | | | | | | | | | | | | | | The OLPC EC driver has outgrown arch/x86/platform/. It's time to both share common code amongst different architectures, as well as move it out of arch/x86/. The XO-1.75 is ARM-based, and the EC driver shares a lot of code with the x86 code. Signed-off-by: Andres Salomon <dilinger@queued.net> Acked-by: Paul Fox <pgf@laptop.org> Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
* | Merge tag 'dt2' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-socLinus Torvalds2012-08-02
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Pull arm-soc Marvell Orion device-tree updates from Olof Johansson: "This contains a set of device-tree conversions for Marvell Orion platforms that were staged early but took a few tries to get the branch into a format where it was suitable for us to pick up. Given that most people working on these platforms are hobbyists with limited time, we were a bit more flexible with merging it even though it came in late." * tag 'dt2' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (21 commits) ARM: Kirkwood: Replace mrvl with marvell ARM: Kirkwood: Describe GoFlex Net LEDs and SATA in DT. ARM: Kirkwood: Describe Dreamplug LEDs in DT. ARM: Kirkwood: Describe iConnects LEDs in DT. ARM: Kirkwood: Describe iConnects temperature sensor in DT. ARM: Kirkwood: Describe IB62x0 LEDs in DT. ARM: Kirkwood: Describe IB62x0 gpio-keys in DT. ARM: Kirkwood: Describe DNS32? gpio-keys in DT. ARM: Kirkwood: Move common portions into a kirkwood-dnskw.dtsi ARM: Kirkwood: Replace DNS-320/DNS-325 leds with dt bindings ARM: Kirkwood: Describe DNS325 temperature sensor in DT. ARM: Kirkwood: Use DT to configure SATA device. ARM: kirkwood: use devicetree for SPI on dreamplug ARM: kirkwood: Add LS-XHL and LS-CHLv2 support ARM: Kirkwood: Initial DTS support for Kirkwood GoFlex Net ARM: Kirkwood: Add basic device tree support for QNAP TS219. ATA: sata_mv: Add device tree support ARM: Orion: DTify the watchdog timer. ARM: Orion: Add arch support needed for I2C via DT. ARM: kirkwood: use devicetree for orion-spi ... Conflicts: drivers/watchdog/orion_wdt.c
| * \ Merge branch 'marvell/dt' into late2/dtOlof Johansson2012-07-29
| |\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | * marvell/dt: (41 commits) ARM: Kirkwood: Replace mrvl with marvell ARM: Kirkwood: Describe GoFlex Net LEDs and SATA in DT. ARM: Kirkwood: Describe Dreamplug LEDs in DT. ARM: Kirkwood: Describe iConnects LEDs in DT. ARM: Kirkwood: Describe iConnects temperature sensor in DT. ARM: Kirkwood: Describe IB62x0 LEDs in DT. ARM: Kirkwood: Describe IB62x0 gpio-keys in DT. ARM: Kirkwood: Describe DNS32? gpio-keys in DT. ARM: Kirkwood: Move common portions into a kirkwood-dnskw.dtsi ARM: Kirkwood: Replace DNS-320/DNS-325 leds with dt bindings ARM: Kirkwood: Describe DNS325 temperature sensor in DT. ARM: Kirkwood: Use DT to configure SATA device. ARM: kirkwood: use devicetree for SPI on dreamplug ARM: kirkwood: Add LS-XHL and LS-CHLv2 support ARM: Kirkwood: Initial DTS support for Kirkwood GoFlex Net ARM: Kirkwood: Add basic device tree support for QNAP TS219. ATA: sata_mv: Add device tree support ARM: Orion: DTify the watchdog timer. ARM: Orion: Add arch support needed for I2C via DT. ARM: kirkwood: use devicetree for orion-spi ...
| | * | ARM: Kirkwood: Replace mrvl with marvellAndrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | It has been decided to use marvell, not mrvl, in the compatibility property. Search & replace. Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Describe GoFlex Net LEDs and SATA in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | Signed-off-by: Andrew Lunn <andrew@lunn.ch> Tested-by: Josh Coombs <josh.coombs@gmail.com>
| | * | ARM: Kirkwood: Describe Dreamplug LEDs in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Describe iConnects LEDs in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Describe iConnects temperature sensor in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | Now that we have I2C support in DT, describe the LM63 in the DT file for the iConnect. Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Describe IB62x0 LEDs in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | Signed-off-by: Andrew Lunn <andrew@lunn.ch> Tested-by: Simon Baatz <gmbnomis@gmail.com>
| | * | ARM: Kirkwood: Describe IB62x0 gpio-keys in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Now that the GPIO controllers have been converted over to DT, described the gpio-keys in DT. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Tested-by: Simon Baatz <gmbnomis@gmail.com>
| | * | ARM: Kirkwood: Describe DNS32? gpio-keys in DT.Jamie Lentin2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | Move description of GPIO keys on both the DNS320 and DNS325 into DT. Signed-off-by: Jamie Lentin <jm@lentin.co.uk> Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Move common portions into a kirkwood-dnskw.dtsiJamie Lentin2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | A lot of device setup is shared between DNS-320 and DNS-325, move the definitions into a common include. Signed-off-by: Jamie Lentin <jm@lentin.co.uk> Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Replace DNS-320/DNS-325 leds with dt bindingsJamie Lentin2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | Replace code in board-dnskw with the equivalent devicetree bindings. Signed-off-by: Jamie Lentin <jm@lentin.co.uk> Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Describe DNS325 temperature sensor in DT.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Now that we have I2C support in DT, describe the LM75 in the DT file for the DNS325. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Jamie Lentin <jm@lentin.co.uk>
| | * | ARM: Kirkwood: Use DT to configure SATA device.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Convert boards using DT, but the old way of configuring SATA to now use properties in there DT file. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Tested-by: Simon Baatz <gmbnomis@gmail.com>
| | * | ARM: kirkwood: use devicetree for SPI on dreamplugMichael Walle2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | Use the device tree for the SPI driver and partition layout. Signed-off-by: Michael Walle <michael@walle.cc> Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: kirkwood: Add LS-XHL and LS-CHLv2 supportMichael Walle2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for Buffalo Linkstation LS-XHL and LS-CHLv2 using the device tree where possible. Signed-off-by: Michael Walle <michael@walle.cc> Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Initial DTS support for Kirkwood GoFlex NetJosh Coombs2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch supplies the necessary DTS and supporting files to boot up a Seagate GoFlex Net with 3.5.0-rc3. Signed-off-by: Joshua Coombs <josh.coombs@gmail.com> Signed-off-by: Andrew Lunn <andrew@lunn.ch>
| | * | ARM: Kirkwood: Add basic device tree support for QNAP TS219.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The two different variants of QNAP TS devices, varying by SoC, put the GPIO keys on different GPIO lines. Hence we need two different DT board descriptions, which share the same board-ts219.c file. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Acked-by: Jason Cooper <jason@lakedaemon.net>
| | * | ATA: sata_mv: Add device tree supportAndrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for instantiating this driver from device tree, and add the necassary DT information to the kirkwood.dtsi file. This is based on previous work by Michael Walle and Jason Cooper. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Tested-by: Josh Coombs <josh.coombs@gmail.com>
| | * | ARM: Orion: DTify the watchdog timer.Andrew Lunn2012-07-27
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add device tree support to the Orion watchdog timer, and enable its use in the kirkwood devices using device tree. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Acked-by: Sebastian Hesselbarth <sebastian.hesselbarth@googlemail.com> Tested-by: Simon Baatz <gmbnomis@gmail.com>
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